4 ms·
Pieced together more info: Top plate and middle gold plate are water cooling Bottom thick PCB with connectors is VRMs/Power distribution Based on
by virtuallynathan 5y ago
Pieced together more info:
Top plate and middle gold plate are water cooling
Bottom thick PCB with connectors is VRMs/Power distribution
Based on TSMC InFO_SoW, chips are ~26x26mm (~676mm2), close to the TSMC 7nm reticle limit
Each 300mm wafer yields 25 chips, so each module is a full wafer
20 pairs of chips around the perimeter are likely IO/SerDes
may be like the Cerebras WSE with only on-chip SRAM and no external memory
Each chip could be up to ~400W, meaning each module is ~10kW+, more for power losses, IO, etc
Thanks to: https://twitter.com/idontwa86202030/status/1422566179131043846?s=20 https://twitter.com/idontwa86202030/status/14225661791310438...