3mm radius is very impressive. My former workgroup was able to get almost the same curvature accidentally on a Nanodimension PCB printer by forgetting to UV/hea

3mm radius is very impressive. My former workgroup was able to get almost the same curvature accidentally on a Nanodimension PCB printer by forgetting to UV/heat cure the substrate properly, but that was PCB scale (mm instead of um) and the resistance was then far too high to be usable. As I'm a MechE before all else, I'd be most interested in structural performance: usability after n strain cycles, resistance to environmental exposure, allowable strain/shear/bending in all dimensions (polyamide, so not much normal strain), heat transport, whether it can be operated inside a fluid/gel, etc. There are some questions making me wonder what is more likely between an FPGA, Arm Cortex (or other RISC), or a fully nonprogrammable IC being most successfully deployed in a flexible form factor: How would this be packaged for an end user? Should it be programmable with on-board NVM and a debug port? Or is it programmed with wafer probes during manufacture? What would then be the standard for flexible debug ports? Ideally something easy to connect using automation but (a) small enough to leave on and ignore, or (b) able to be cut off completely for production. Would this still be CoreSight-compliant e.g. having a discoverable ROM table, so anyone with a USB wiggler can attach? In short, how technical must a user be to program this? Is this then attached to a flexible PCB using BGA? Electronic fabric using thin conductors? Present-day developers have the alternative of buying a KL02 (2mm x 1.9mm; decidedly better specs/capability) and putting it on a flex PCB. More progress on bendable/non-silicon CPUs would be awesome, and maybe one day they will have a clearer purpose or better economics to displace existing tech. I'd reserve any final judgment until a test unit or third-party publication appears. In my eyes, there are gains enough from having an alternative library for the cell architecture. Arm Ltd. involved in the testing suggests a shorter road to market than if undergrad Joe in Dr. Smith's lab published this.