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This is real, shipping technology. See 3d nand flash cells, see stacked cache and HBM memory. All the usual characters are working on it. Intel, AMD (TSMC), Sa
by eloff 5y ago
This is real, shipping technology.
See 3d nand flash cells, see stacked cache and HBM memory. All the usual characters are working on it. Intel, AMD (TSMC), Samsung.
Cooling is an issue, but there are solutions.
- cogman10 5y ago3d cells for nand aren't the same as 3d CPU cores. Nand is incredibly simple which makes it possible to do things like 3d cells which would otherwise be more complicated. There's a reason memory can generally beat computational cores to smaller node sizes. It's because highly uniform circuits are much easier to manufacture. A lot of problems present in CPU logic cores (such as cross talk) just aren't present to the same extent in NAND cells.
- duck2 5y agoMaybe stuff like Upmem (many small CPUs embedded into memory) can take off then?
- cogman10 5y agoPossibly, that'd be one of the "major architectural changes" that I mentioned earlier. Things we've simply not tried yet because they are too radically different from the way hardware currently works.
- lovemenot 5y agoSorry to have to ask.Could you please show a Wikipedia-like intro to Upmem? It may be a simple typing problem, but Wikipedia doesn't seem to have it.
- duck2 5y agoI found a previous HN submission about them: https://news.ycombinator.com/item?id=20766283 https://news.ycombinator.com/item?id=20766283