Why are you confident about this? Semiconductor processes are complicated for a ton of reasons, and a process which is optimized for making main memory (DRAM) h

Why are you confident about this? Semiconductor processes are complicated for a ton of reasons, and a process which is optimized for making main memory (DRAM) has some differences from a process optimized for making logic (CPU), and flash memory is different still. I see AMD's effort as a way to sidestep the whole problem of putting memory and CPU on the same chip, by making separate chips and stacking them. It makes sense. You can get CPU packages with CPU + DRAM + Flash, but these are separate chips which are wired together inside the package. E.g. https://en.wikipedia.org/wiki/Package_on_a_package https://en.wikipedia.org/wiki/Package_on_a_package The whole point of these systems is to avoid putting memory and CPU (and flash) on the same chip. AMD's version is smaller & more integrated than package-on-package but it still achieves the same goal: multiple chips.