Intel's been showing off a lot of 3D stacking tech & mixed dies on packages recently, too. This isn't really a kockdown punch. It'll depend on who can ship what

Intel's been showing off a lot of 3D stacking tech & mixed dies on packages recently, too. This isn't really a kockdown punch. It'll depend on who can ship what and when, not just who can show off demos. They both have shown off demos. See Intel's Foveros https://www.anandtech.com/tag/foveros https://www.anandtech.com/tag/foveros or Ponte Vecchio that they've been talking about for 2 years now ( https://www.anandtech.com/show/16453/intel-teases-ponte-vecchio-xehpc-power-on-posts-photo-of-server-chip https://www.anandtech.com/show/16453/intel-teases-ponte-vecc... )