3 ms·
>still be within the current Xeon 200W TDP envolope Apple needs very high performance core designs that also work in the thermal envelope of a handheld phone o
by GeekyBear 5y ago
>still be within the current Xeon 200W TDP envolope
Apple needs very high performance core designs that also work in the thermal envelope of a handheld phone or a fanless laptop.
As noted when the A14 launched, taking the power/heat cut at the 7nm node change resulted in better sustained performance for those chips
>The one explanation and theory I have is that Apple might have finally pulled back on their excessive peak power draw at the maximum performance states of the CPUs and GPUs, and thus peak performance wouldn’t have seen such a large jump this generation, but favour more sustainable thermal figures.
https://www.anandtech.com/show/16088/apple-announces-5nm-a14-soc-meagre-upgrades-or-less-power-hungry https://www.anandtech.com/show/16088/apple-announces-5nm-a14...