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> This tutorial will discuss advanced packaging technologies that enable performance and density improvements. I'm interested in advanced packaging. Does anyon
by segfaultbuserr 5y ago
> This tutorial will discuss advanced packaging technologies that enable performance and density improvements.
I'm interested in advanced packaging. Does anyone know anything about it? My impression is that BGA, MicroBGA, CSP, WLP, Flip-Chip are the evolutionary dead end of packaging, you can't really find a denser way to put a chip on the board. So instead, you put more things into the package or onto the interposer, and for the user, the new "module" can be used just like a chip, this is the System-in-Package approach, such as integrating the chiplet and RAM to a processor, or stacking multiple silicon dies on top of each other. This is my understanding, but is there anything new to see?
- ksec 5y ago>This is my understanding, but is there anything new to see? You mean something like Intel EMIB [1], something like CO-EMIB? Or CoWoS from TSMC. It is not "new" in terms of tech news sense, but it is still very new from a technological perspective. If you want something "newer", there are none. Those are already leading edge. ( And has been in R&D for nearly a whole decade ) [1] https://www.intel.com/content/www/us/en/foundry/emib.html https://www.intel.com/content/www/us/en/foundry/emib.html