This is pretty much it. Why do we use a BGA or WLCSP rather than a DIP package? Because we can’t fit a DIP package into the form factor, and manufacturing costs

This is pretty much it. Why do we use a BGA or WLCSP rather than a DIP package? Because we can’t fit a DIP package into the form factor, and manufacturing costs are higher. Why did we glue/epoxy a few components to the board? Because the device needed to pass a drop test such that components aren’t flying off. Why did we ultrasonically weld the enclosure shut? Because we needed IP68 or above rating and the price point we were trying to hit made that the most viable. I don’t necessarily have a problem with right to repair, but a lot of people don’t understand what goes into designing these things and attribute a lack of repairability with malfeasance rather than just the reality of manufacturing, economics, and consumer demands.