4 ms·

The specific package used is a TSOP-I-40L, standard registration JEDEC MO-142, controlling document here [0]. These things are super common for RAM or Flash in

The specific package used is a TSOP-I-40L, standard registration JEDEC MO-142, controlling document here [0]. These things are super common for RAM or Flash in older designs or designs trying to avoid BGA parts (because BGAs are awful for anything but high-automation, high-volume work). The 0.5mm pin pitch is on the tighter side for gull-wing parts, but it's also super common itself. Many QFP processors are even tighter at 0.4mm pin pitch, and 0.5mm is very common for discretes and DFNs/QFNs. So it's no trouble whatsoever for assemblers; they do these things all day, every day, and won't even blink if you ask for one. The legs also make it amenable to manual rework, as shown in the article. If I were designing this part in, I wouldn't think twice about using this package (used board area aside). If there were multiple packages available for a part, this one would probably actually be high on my "ease of working with" list! [0] (Registration required) https://www.jedec.org/standards-documents/docs/mo-142-d https://www.jedec.org/standards-documents/docs/mo-142-d

nousermane 6y ago
Great explanation, thanks. > I wouldn't think twice about using > this [TSOP-I-40/48L] package > ... > high on my "ease of working with" list Assuming MCU/CPU can handle it, I'd personally avoid 48-pin 0.5 mm pitch TSOPs in favor of 1.27mm pitch SOIC-8/WSON-8. For 2Gbit NAND - Winbond W25N02GV, or similar part. BTW, large-ish NOR flash (8 Mbit and up) used to be only available in 0.5-mm-pitch TSOP parallel parts only, up to a decade ago. Nowadays, it's mostly 8-pin 25Qxx parts.
- exmadscientist 6y ago
  Right, but you're comparing serial flash with parallel flash. Very different animals in terms of support! I agree, there's no reason to use anything with more than 8 pins for a serial flash. Though I usually end up with MSOP or TSSOP, myself, probably since I rarely have to rework them. (Avoid the smaller DFNs, I always seem to have the worst luck with sourcing those when I need them. Even though they're always perfectly available at design-in....) SOIC-8 is the way to go for op-amps, though. Manufacturers don't say it loudly, but any part which isn't package trimmed will always perform better in larger packages. It's not a huge effect, but if you have a free choice, why not? They're also easier to rework, and analog stuff often needs a rework or R-C across the pins or whatever.

nousermane 6y ago

Great explanation, thanks. > I wouldn't think twice about using > this [TSOP-I-40/48L] package > ... > high on my "ease of working with" list Assuming MCU/CPU can handle it, I'd personally avoid 48-pin 0.5 mm pitch TSOPs in favor of 1.27mm pitch SOIC-8/WSON-8. For 2Gbit NAND - Winbond W25N02GV, or similar part. BTW, large-ish NOR flash (8 Mbit and up) used to be only available in 0.5-mm-pitch TSOP parallel parts only, up to a decade ago. Nowadays, it's mostly 8-pin 25Qxx parts.

exmadscientist 6y ago
Right, but you're comparing serial flash with parallel flash. Very different animals in terms of support! I agree, there's no reason to use anything with more than 8 pins for a serial flash. Though I usually end up with MSOP or TSSOP, myself, probably since I rarely have to rework them. (Avoid the smaller DFNs, I always seem to have the worst luck with sourcing those when I need them. Even though they're always perfectly available at design-in....) SOIC-8 is the way to go for op-amps, though. Manufacturers don't say it loudly, but any part which isn't package trimmed will always perform better in larger packages. It's not a huge effect, but if you have a free choice, why not? They're also easier to rework, and analog stuff often needs a rework or R-C across the pins or whatever.