I'm expecting apple to go the tiles or chiplet route for their workstation processors. TSMC have been working on some advanced packaging methods that are ideal

I'm expecting apple to go the tiles or chiplet route for their workstation processors. TSMC have been working on some advanced packaging methods that are ideal for this usecase. Apple could make one 16 core die and offer workstations with anywhere between one and four tiles for 16 to 64 cores. As for the high end laptops and iMacs, I'm expecting Apple to launch a monolithic 8+4 chip. That would be just 3 unique dies to cover Apples entire Mac lineup.