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I believe you design special fuses on the chip that can be "blown" with a laser after testing and before putting the silicon in the protective packaging.
by PeterisP 6y ago
I believe you design special fuses on the chip that can be "blown" with a laser after testing and before putting the silicon in the protective packaging.
- p_j_w 6y agoFuses aren't blown with a laser, it's purely electrical. You apply a sufficiently high voltage to some port on the part from a source that can drive a high enough current and then tell the digital block of the chip which address to fuse and if you want it high or low. Repeat for the entire fuse bank and you're done. https://en.wikipedia.org/wiki/Efuse https://en.wikipedia.org/wiki/Efuse