3 ms·
This thing is awesome and, as someone working for a competitor, kind of scary. I applaud their approach though. I think we're a couple years off from it, but
by 01100011 6y ago
This thing is awesome and, as someone working for a competitor, kind of scary. I applaud their approach though. I think we're a couple years off from it, but we'll probably see wider adoption of larger silicon, with more specialized functional units, which are used with a lower duty cycle to manage heat. If nothing else, they're probably developing some good IP and techniques to handle other sorts of ultra-mega-insane-scale-integration.
I wonder what their software stack looks like. Can they support the sort of virtualization and sharing you'd want to keep this expensive beast fully utilized 24/7?
- ohazi 6y agoLSI, VLSI, UMISI I like it! In previous articles they've gone into some detail about how they deal with reticle limits, jumping over the scribe line area, and other n stuff. Between that, chiplets, HBM-style die stacks, etc... the developments here have been more interesting than I expected.