3 ms·
How do they do heat management and dissipation on such a big wafer? I can imagine some different parts heats up differently, putting a mechanical strain on wafe
by tandr 5y ago
How do they do heat management and dissipation on such a big wafer? I can imagine some different parts heats up differently, putting a mechanical strain on wafer, and leading to cracks.
- punnerud 5y agoA large portion of the article is answering most of this
- tandr 5y agoNo, it does not. There is a paragraph _talking_ about it, but not much info still.
- NortySpock 5y ago"Carefully." The article mentions a year of engineering went into dealing with the entire wafer thermally expanding under load.
- addaon 5y agoIf you look at the die shots (wafer shots?), you'll notice small holes a few millimeters across spaced roughly at reticle spacing. Those are drilled holes to allow through-wafer liquid cooling. With liquid cooling not just around but through the wafer, the temperature differential is minimized.
- tandr 5y agothank you