Former automotive R&D guy here. It was quite some time ago but my colleagues in the chip department (we were all new grads at the time) were telling me that the

Former automotive R&D guy here. It was quite some time ago but my colleagues in the chip department (we were all new grads at the time) were telling me that they were designing chips with triple redundancy. "Hood Space" is a fierce competition among vendors to get into car models 5 years in the future, but miniaturization needs are nowhere near that of the consumer electronic space (this was shocking to me, having been raised in SV in a family working in the PC industry!) Fast forward some years later and I was working at a motion sensor company for consumer electronics. Our node sizes were like 40-50nm and many generations behind cutting edge ICs. Lower margins but meaningful volume. Our fab was naturally, you guessed it, TSMC.