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I think these are just press/PR wafers and real production ones don't pattern on the edge. (First of all it takes time, and in case of EUV it means things amort

by pas 6y ago

I think these are just press/PR wafers and real production ones don't pattern on the edge. (First of all it takes time, and in case of EUV it means things amortize even faster, because every shot damages the "optical elements" a bit.) edit: it also depends on how many dies the mask (reticle) has on it. Intel uses one die reticles, so i. theory their real wafers have no situation in which they have partial dies at the edge.

dogma1138 6y ago
Real wafers have the chip patterning going to the edge and this can results and often does in partial dies. There is no reason not too so this and the edges are also often used for calibration and (potentially) destructive testing. The only area of the wafer that will not be exposed is the notch, it’s always on one side of the circle and it’s used for moving the wafer around, this is why you often see wafers with one of the sides cut off giving it the flat tire shape.