This article makes decent claims about power issues based on the architecture backport, but it lost me right here: > Because Intel makes tens of millions of 14

This article makes decent claims about power issues based on the architecture backport, but it lost me right here: > Because Intel makes tens of millions of 14nm dies that are about 2x as large as Rocket Lake every year. They are called Xeons, specifically the HCC Xeon die which was 601.92mm^2 for Skylake-SP, larger for Cascade Lake. Intel unquestionably can make 14nm dies that are a multiple larger than Rocket, 10C would not be an issue at all if they wanted to manufacture it. Have you seen the obscene physical size of those sockets? When you get larger than HEDT (LGA 2066 sockets) (and even then) the mere act of a user installing their own cpu becomes a dangerous enough proposition that Intel won’t even allow you to seat the cpu on the pin array. You have to slide Xeons into the heatsink clamp. They are limited to what a regular consumer expects to do. Yes Intel screwed up royal on lithography processes, and probably need a cash infusion which they will likely get due to a newly competent CEO selling this stopgap to OEMs.