Intel already said they would use chiplets [1] and TSMC has been talking about the various packaging technologies being developed [2]. [1] https://www.anandtec

Intel already said they would use chiplets [1] and TSMC has been talking about the various packaging technologies being developed [2]. [1] https://www.anandtech.com/show/16021/intel-moving-to-chiplets-client-20-for-7nm https://www.anandtech.com/show/16021/intel-moving-to-chiplet... [2] https://www.anandtech.com/show/16051/3dfabric-the-home-for-tsmc-2-5d-and-3d-stacking-roadmap https://www.anandtech.com/show/16051/3dfabric-the-home-for-t...