It's wild to see electromigration and temperature-driven aging come back as a concern at today's dense process nodes. Pecht's landmark work in the early ninetie

It's wild to see electromigration and temperature-driven aging come back as a concern at today's dense process nodes. Pecht's landmark work in the early nineties mostly debunked the old handbook models that were based on those causes of failure. Most electronics will still fail due to overstress or mechanical fatigue from vibration or temperature cycling, of course, but it's really interesting to see these concerns return.