3 ms·
Speaking for myself, this is the first time I've heard of multiple modules in the same chip. Hearing about it now and knowing generally how dies[1] are manufact
by andreareina 6y ago
Speaking for myself, this is the first time I've heard of multiple modules in the same chip. Hearing about it now and knowing generally how dies[1] are manufactured and packaged into ICs it's an obvious thing to do, but yeah never crossed my mind.
[1] dice?
- TheSpiceIsLife 6y agoCongratulations, you're one of today's lucky 10,000 :) https://xkcd.com/1053/ https://xkcd.com/1053/ I'm mildly annoyed by the tendency of some people to be critical while they're correcting (teaching!) someone.
- photojosh 6y agoIt's cool, hey? How AMD (and others) are now doing their CPUs is a good example: there's often several CPU "chiplets" and then one IO chiplet on the same package. [0] is the first good search result. Given what they've done with the M1, I highly suspect Apple will do something like that for their higher end machines. [0] https://www.anandtech.com/show/16148/amd-ryzen-5000-and-zen-3-on-nov-5th-19-ipc-claims-best-gaming-cpu https://www.anandtech.com/show/16148/amd-ryzen-5000-and-zen-...