It's not that far off-base, given that most people don't understand the difference between on-package, where a component is bundled with the CPU on the same chi

It's not that far off-base, given that most people don't understand the difference between on-package, where a component is bundled with the CPU on the same chip, and on-die, where a feature is actually part of the same litho process as the CPU. There's really no meme to trace here; just a popular misunderstanding of semiconductor terminology.