So we have options and this is all ten years out before we actually hit this wall. However, according to this, our current solutions to the issues faced at sub

So we have options and this is all ten years out before we actually hit this wall. However, according to this, our current solutions to the issues faced at sub-20nm lithography were developed by IBM in the 90's. So that is the question. What technique exists today that will be used for the next 30 years? I am envisioning a true death of "Moore's Law" but we will have time before we encounter the limits of Amdahl's law[0] in the use of chiplets and other dedicated hardware. Apple has their T2 and security enclaves, NVIDIA has tensor cores and other fixed function silicon, AMD is proving chiplets with seperate compute dies and I/O dies works well, Intel is now working on the same but for GPU's[1] ontop of compute and I/O, and the new Playstation 5 has a dedicated ARM CPU for the SSD. Having dedicated silicon for specific tasks (such as encryption, ray-tracing, storage, networking, and so on), or even an FPGA of some sort will likely be the future. It will be like the 90's again with northbridge and southbridge chips and 5 or 6 expansion cards. But I am excited to see the solutions that will drive computers for the next 30 years. [0]:https://en.wikipedia.org/wiki/Amdahl%27s_law?wprov=sfla1 https://en.wikipedia.org/wiki/Amdahl%27s_law?wprov=sfla1 [1]:https://www.anandtech.com/show/16021/intel-moving-to-chiplets-client-20-for-7nm https://www.anandtech.com/show/16021/intel-moving-to-chiplet...