4 ms·
Yep, this is indeed very little detail. To me this PR is the PR you send when you just discovered you're late, but try to retain the clients' attention. They f
by BenoitP 6y ago
Yep, this is indeed very little detail. To me this PR is the PR you send when you just discovered you're late, but try to retain the clients' attention.
They felt the wind turning, saw the market ask for it, saw companies like UPMEM having a lead.
If you want more details, UPMEM has more. If I recall correctly they etched their own core right into the same silicon as the DRAM.
Here is a link that I think will satisfy your curiosity: https://www.upmem.com/nextplatform-com-2019-10-03-accelerating-compute-by-cramming-it-into-dram/ https://www.upmem.com/nextplatform-com-2019-10-03-accelerati...
- tmotwu 6y agoIf it interests you - stated at the bottom of the press release, they appear to be presenting a conference accepted paper on this. Looking at the ISSCC program, I presume this is what they're talking about: "A 20nm 6GB Function-In-Memory DRAM, Based on HBM2 with a 1.2TFLOPS Programmable Computing Unit Using Bank-Level Parallelism, for Machine Learning Applications" [1]. I suspect this is where there will be a deep dive into the gory technical details of the architecture and performance. It's tomorrow so it won't be a long wait. [1] https://submissions2.mirasmart.com/ISSCC2021/PDF/ISSCC2021AdvanceProgram.pdf https://submissions2.mirasmart.com/ISSCC2021/PDF/ISSCC2021Ad... (p 38)