I think the reason Intel is not doing multi-die packages is because the R&D to make it work is large and they don't want to take on that risk. What are the dow

I think the reason Intel is not doing multi-die packages is because the R&D to make it work is large and they don't want to take on that risk. What are the downsides, exactly? Thread-to-thread latency is the key one that comes to mind. It is far cheaper to make a multi-die package because yields are so much higher for any given node. The business advantages are great. The bleak picture for Intel that is being painted is warranted.