3 ms·
Edit: My understanding is WRONG, the RAM is separate but on the same package, not on the die. The very nature of the chip package (RAM in the SOC) limits how m
by mey 6y ago
Edit: My understanding is WRONG, the RAM is separate but on the same package, not on the die.
The very nature of the chip package (RAM in the SOC) limits how much more RAM they can package. It increases the cost per chip because it significantly decreases the yield per wafer of the monolithic chip. I will be really curious if they can get much more RAM onto a M1 chip without charging astronomical prices (even by Apple standards).
https://www.youtube.com/watch?v=qgvVXGWJSiE https://www.youtube.com/watch?v=qgvVXGWJSiE Talks about this in detail of chiplet vs monolithic chips in the AMD context back in the Zen 2 days.
- localhost 6y agoPretty sure that the RAM is not part of the same wafer, i.e., the RAM is a chiplet that is subsequently integrated into the SOC. So yield shouldn’t be an issue here.
- mey 6y agoHuh, you are correct! https://www.apple.com/mac/m1/ https://www.apple.com/mac/m1/
- zamadatix 6y agoI wonder if for the larger use cases they'll target a hybrid approach, similar to what Broadwell did but from the reverse perspective.