> which is indispensable for etching chips in 7 and 5 nm This isn't quite accurate; ABF is used to make the chip package for high-thermal transfer, high-speed

> which is indispensable for etching chips in 7 and 5 nm This isn't quite accurate; ABF is used to make the chip package for high-thermal transfer, high-speed flip chip packages: https://www.ajinomoto.com/innovation/action/buildupfilm https://www.ajinomoto.com/innovation/action/buildupfilm It doesn't seem to have a role in any specific manufacturing node; it's just essential to the best way of packaging high-end chips.