TSMC's 3nm will still be FinFETs rather than any of the more 3D-ish transistor designs: https://www.anandtech.com/show/16041/where-are-my-gaafets-tsmc-to-stay-w

TSMC's 3nm will still be FinFETs rather than any of the more 3D-ish transistor designs: https://www.anandtech.com/show/16041/where-are-my-gaafets-tsmc-to-stay-with-finfet-for-3nm https://www.anandtech.com/show/16041/where-are-my-gaafets-ts... Other "3D stacking" tech you may have been hearing about is packaging tech that isn't really tied to particular fab nodes—and that's one of the main motivations for advanced 3D packaging: you don't need to make all your chiplets on the same process.