> To your main points, they have yet to fully utilize advanced packaging (TSMC 3D for example) to get much more RAM in the SOC. The M1 is using off the shelf L

> To your main points, they have yet to fully utilize advanced packaging (TSMC 3D for example) to get much more RAM in the SOC. The M1 is using off the shelf LPDDR4 modules on the package but not on the die. 3D stacking is possible for denser DRAM modules but wouldn't make much sense compared to just adding 2 more DRAM modules and spending the physical space on it - there's more than enough room especially in devices like the Mac Mini. A boring ol' daisy chain setup would work perfectly fine here.