I didn’t say they never failed. Just that they fail less frequently. In any case, solder ball cracking results from process issues and is a solved problem: ht

I didn’t say they never failed. Just that they fail less frequently. In any case, solder ball cracking results from process issues and is a solved problem: https://www.pcbcart.com/article/content/reasons-for-cracks-in-bga-soldering.html https://www.pcbcart.com/article/content/reasons-for-cracks-i... Certain not something that would be improved with sockets.