2 ms·
> It turns out that soldering parts in place makes them less likely You've obvious never heard of MBP BGA chip solder ball cracking and rendering the whole dev
by alacombe 6y ago
> It turns out that soldering parts in place makes them less likely
You've obvious never heard of MBP BGA chip solder ball cracking and rendering the whole device useless...
- zepto 6y agoI didn’t say they never failed. Just that they fail less frequently. In any case, solder ball cracking results from process issues and is a solved problem: https://www.pcbcart.com/article/content/reasons-for-cracks-in-bga-soldering.html https://www.pcbcart.com/article/content/reasons-for-cracks-i... Certain not something that would be improved with sockets.