3 ms·
Not much. HBM will not gain much from going inside the chip pachage over existing interposer solution.
by baybal2 6y ago
Not much. HBM will not gain much from going inside the chip pachage over existing interposer solution.
- baybal2 6y agoThough, you may decide foregoing the interposer. This way, money go TSMC instead of interposer maker, which was already likelly been TSMC.