The goals here are kind of sideways from heat dissipation. * Different parts from different processes — for example DRAM and CPU need different processes, so i

The goals here are kind of sideways from heat dissipation. * Different parts from different processes — for example DRAM and CPU need different processes, so it doesn't work to put them on the same chip — this integration is a step closer than on-package. * Yield — if you really want sixteen cores, and you're pushing the edge of your process, your yield for perfect eight-core chiplets will be dramatically better than for a sixteen-core chip or chiplet. But yeah concentrating all that into multi-chip chip will also concentrate the heat.