3 ms·
I assume keeping the parts cool becomes a big issue. You get twice the amount of heat to dissipate within the same area. Or is there some workaround?
by imbusy111 6y ago
I assume keeping the parts cool becomes a big issue. You get twice the amount of heat to dissipate within the same area. Or is there some workaround?
- ksec 6y agoNo Workaround AFAIK, the idea right now is not to stack compute die on top of each other but other things like SRAM or parts that uses little energy for both cost and space efficiency.
- neolefty 6y agoThe goals here are kind of sideways from heat dissipation. * Different parts from different processes — for example DRAM and CPU need different processes, so it doesn't work to put them on the same chip — this integration is a step closer than on-package. * Yield — if you really want sixteen cores, and you're pushing the edge of your process, your yield for perfect eight-core chiplets will be dramatically better than for a sixteen-core chip or chiplet. But yeah concentrating all that into multi-chip chip will also concentrate the heat.
- baybal2 6y ago> Or is there some workaround? Synthetic diamonds, heatspreaders in the package
- the8472 6y ago*Isotopically pure diamonds
- nynx 6y agoThe work around would be microfluidic coolers, which aren't production ready yet, I believe.