5 ms·Could this be used for the next generation of HBM?by The_rationalist 6y agoCould this be used for the next generation of HBM?baybal2 6y agoNot much. HBM will not gain much from going inside the chip pachage over existing interposer solution.baybal2 6y agoThough, you may decide foregoing the interposer. This way, money go TSMC instead of interposer maker, which was already likelly been TSMC.