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“TSMC is now taking chip packaging vertically and horizontally, using a new 3-D technology that it dubs SoIC.” They picked a name for it that is already a comm
by TaylorAlexander 6y ago
“TSMC is now taking chip packaging vertically and horizontally, using a new 3-D technology that it dubs SoIC.”
They picked a name for it that is already a common term in chip packaging. Face meet palm.
- TheSpiceIsLife 6y agoI had to look that one up. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. https://en.wikipedia.org/wiki/Small_outline_integrated_circuit https://en.wikipedia.org/wiki/Small_outline_integrated_circu... I suspect companies do these make collisions intentionally.
- ZeteticElench 6y agoNo, it means System on Integrated Chips https://3dfabric.tsmc.com/english/dedicatedFoundry/technology/SoIC.htm#SoIC_CoW https://3dfabric.tsmc.com/english/dedicatedFoundry/technolog...