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Putting the CPU and RAM on the same die is absolutely not the future. Not only is it impossible to mix and match process technologies in that way, it would be e
by xadhominemx 6y ago
Putting the CPU and RAM on the same die is absolutely not the future. Not only is it impossible to mix and match process technologies in that way, it would be extremely wasteful given the far greater numbers of metal layers on a CPU and the performance improvement would be marginal. The same is even more true with integrating CPU and NAND flash.
- ericpauley 6y agoPretty sure the M1 memory is not on the same die, just on the same "chip". You can see a separation in the teardowns and Apple's advertising materials don't show it on the die images.
- xadhominemx 6y agoI’ve never heard someone use the word chip other than to describe an IC.