4 ms·
Or package level integration...
by andy_ppp 6y ago
Or package level integration...
- gumby 6y agoPossible, but I suspect heat and area would be problems, at least for the CPUs. A smaller AMD core could be supplied as a hard core on the Xilinx part but would that really be worth it?
- state_less 6y agoIt would be an interesting to get a cpu, gpu and fpga in one package. ML abstractions could be sent to the most sensible implementation. Maybe handheld mobile SDR transceivers could benefit from such an arrangement too. AMD has had some great low power parts and maybe they’ll drive for that here?
- gumby 6y ago“Lowmpower” is not what comes to mind when I think “FPGA”.
- pclmulqdq 6y agoIntel had some heat problems when they tried this. The FPGAs weren't able to use their heat budget dynamically, and as a result, the whole SiP had bad performance.
- lallysingh 6y agoAMD chiplets?
- andy_ppp 6y agoYes this was my thought too, does heat from a separate chiplet really effect the other cores maybe a cm away? I don’t know...