3 ms·
Oh yeah, it's a problem: both of Intel's big recent process holdups (cobalt wires, contact over active gate) almost certainly happened because thermal cycling c
by jjoonathan 6y ago
Oh yeah, it's a problem: both of Intel's big recent process holdups (cobalt wires, contact over active gate) almost certainly happened because thermal cycling caused more problems than expected from pre-production tests.
- avianes 6y agoI would be highly curious for more information on this subject. Do you have any sources/information related to thermal cycling damage to cobalt wires or COAG?