I guess if we hit the edge of feature density, we might start building things out of 3d FPGA type designs of homogeneous modules but because of heat, the capaci

I guess if we hit the edge of feature density, we might start building things out of 3d FPGA type designs of homogeneous modules but because of heat, the capacity of such a design is ultimately going to be limited by its surface area, not its volume, no?