Slightly off-topic: why SoCs? Cramming everything into a single die seems to be a poor design decision since your die size is likely to be limited by yield cons

Slightly off-topic: why SoCs? Cramming everything into a single die seems to be a poor design decision since your die size is likely to be limited by yield considerations. Curious why Apple doesn't go for ASICs inside a SiP or tightly coupled on an interposer/PCB.