Excerpts: "Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers." [...] "A thermosonic bond is formed using a set of pa

Excerpts: "Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers." [...] "A thermosonic bond is formed using a set of parameters which include ultrasonic, thermal and mechanical (force) energies." Future Idea: Bonding should be studied from the perspective of using a variety of substrates/energies, including but not limited to: electricity, magnetism, infrared, light, ultraviolet, sound, and a variety of chemicals and materials (both similar and dissimilar) to be bonded... The reverse (unbinding) should also be studied, under all of those conditions. A future science would create all kinds of tables (or perhaps equations) where you could see what effect a specific energy or energies would have on specific materials, at what temperatures, frequencies, combinations, etc.