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> If AMD/TSMC develop a way to stack chiplets in 3 dimensions, we could wind up with another huge bump in logical transistor density per socket/node. Stacking
by wtallis 7y ago
> If AMD/TSMC develop a way to stack chiplets in 3 dimensions, we could wind up with another huge bump in logical transistor density per socket/node.
Stacking is pretty close to being a solved problem. Cooling a stack of high-power chips is the challenge.
- Animats 7y agoRight. Memory can be stacked. Flash memory, especially. Only a small fraction of memory cells do anything on each cycle. But parts where most of the gates do something on every clock, like CPUs, heat up too much.