> Could the tin whisker problem be solved by simply reflowing circuit boards every 5-10 years Apart from logistics, many components have a hard time surviving

> Could the tin whisker problem be solved by simply reflowing circuit boards every 5-10 years Apart from logistics, many components have a hard time surviving the heat of soldering during original manufacture and may fail on subsequent reflowing. Lead free solder typically has a melting point around 35C higher than tin-lead which exacerbates the problem.