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Really interestingly, the IO die and the X570 chipset are both the same piece of silicon running different firmware. That's creative and an interesting vector
by paulmd 7y ago
Really interestingly, the IO die and the X570 chipset are both the same piece of silicon running different firmware. That's creative and an interesting vector to increase your yields.
- gruez 7y agosource for this?
- anon73044 7y agohttps://mobile.twitter.com/IanCutress/status/1138443875154944000 https://mobile.twitter.com/IanCutress/status/113844387515494... Has some details, but doesn't state it explicitly: https://www.tomshardware.com/amp/news/amd-64-core-epyc-cpu-die-design-architecture-ryzen-3000 https://www.tomshardware.com/amp/news/amd-64-core-epyc-cpu-d... "Those processors are a complete system on a chip with both the northbridge and southbridge on-chip." https://en.wikichip.org/wiki/amd/cores/matisse https://en.wikichip.org/wiki/amd/cores/matisse