Developing a state of the art wafer scanner for EUV lithography would probably take decades, many billions of dollars (not tens but more likely closer to $100B)

Developing a state of the art wafer scanner for EUV lithography would probably take decades, many billions of dollars (not tens but more likely closer to $100B), violate thousands of patents and the end result would 100% be inferior to what the entrenched players (which for EUV lithography is de facto only a single company, ASML) have on offer today, which means it would actually put you at a competitive disadvantage as a foundry, compared to competitors that just buy the state of the art machines. Add to that it already takes huge effort and investment to run a fab, semiconductor manufacturing isn’t a process where you just get some gear, then press a button and wait until the chips roll out. It takes billions and months to years to just switch to a new process node. That’s TSMC’s core business: using the tools to make chips, not make the tools themselves, and that’s already extremely hard. It’s not a coincidence there are basically only 3 big players left that can compete at the most advanced process nodes. Development on ASML NXE EUV scanners started ~20 years ago and only since very recently are they being used for high volume production. There is literally zero chance anyone would be able to profitably build the same thing from scratch again, at least not unless they find some radically different way to make semiconductors.