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Intel, Samsung and TSMC are the only three companies that are committed to EUV. Intel is out, which leaves Samsung and TSMC. So I guess the >1 = 2.
by selectodude 7y ago
Intel, Samsung and TSMC are the only three companies that are committed to EUV. Intel is out, which leaves Samsung and TSMC. So I guess the >1 = 2.
- dragontamer 7y agoThe I/O die is rumored to be GlobalFoundries. AMD's Ryzen 9 3900x and 3950x is a chiplet design: there are 2x TSMC 7nm dies tied to a 1x GloFo 14nm I/O die. See the picture: https://images.anandtech.com/doci/14605/Ryzen9_3800X_Hand_575px_678x452.jpg https://images.anandtech.com/doci/14605/Ryzen9_3800X_Hand_57... In effect, AMD spends very little money and die-area on expensive 7nm process, while leveraging their GloFo 14nm contracts to cheaply make I/O and memory controllers. ---------- The 7nm chiplet is a single design: mass produced for EPYC, Threadripper, and Ryzen. The 14nm I/O die is what differentiates between EPYC, Threadripper, and Ryzen. The I/O die can have 2x memory controllers (Ryzen), 4x memory controllers (Threadripper), or 8x memory controllers (EPYC)... supporting 2x dies, 4x dies, or 8x dies as appropriate.
- kllrnohj 7y ago> The I/O die is rumored to be GlobalFoundries It's not really "rumored" to be so much as it is actually. The I/O dies are built at GlobalFoundries. The Epyc's larger I/O die is on GF's 14nm, and the consumer Ryzen I/O dies are GF's 12nm. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome https://www.anandtech.com/show/14525/amd-zen-2-microarchitec...