3 ms·

> That's inaccurate and doesn't actually make sense. You want a steep temperature gradient at the limited chip surface to maximize heat flux. Pumping a liquid

> That's inaccurate and doesn't actually make sense. You want a steep temperature gradient at the limited chip surface to maximize heat flux. Pumping a liquid with high heat capacity to it steepens the gradient where you need it. Cooling the liquid on the other hand can happen over a much larger surface area with shallower gradients and thus lower heat flux. Note that while the heat pipes in air coolers do use convection they do so passively, liquid cooling solutions are active.

Someone1234 7y ago
You've not really added anything to the discussion here, but seem to be using verbose language in an attempt to convey expertise. For example this: > You want a steep temperature gradient at the limited chip surface to maximize heat flux. Is true with both and is really just a convoluted way of saying "if you don't convect heat fast enough, it won't work." Yeah, undeniably true... > Pumping a liquid with high heat capacity to it steepens the gradient where you need it. Where you need it is at the surface of the CPU package. Both solutions provide adequate heat capacities at that location, that's why they fundamentally work. One uses heat pipes and fins directly above with fans/air carrying the heat away, the other moves the heat, and does the same elsewhere. > Cooling the liquid on the other hand can happen over a much larger surface area with shallower gradients and thus lower heat flux. Note that while the heat pipes in air coolers do use convection they do so passively, liquid cooling solutions are active. This is a basic explanation of how water cooling works, it doesn't really add any specific insight into the problem scope.
- deleted 7y ago
  [deleted]
- the8472 7y ago
  You updated your post since I have made my comment. I have no issues with the new version.
  - Someone1234 7y ago
    I did tone down the language immediately after posting it. But you also altered yours after posting it (the third paragraph was a later addition).

Someone1234 7y ago

You've not really added anything to the discussion here, but seem to be using verbose language in an attempt to convey expertise. For example this: > You want a steep temperature gradient at the limited chip surface to maximize heat flux. Is true with both and is really just a convoluted way of saying "if you don't convect heat fast enough, it won't work." Yeah, undeniably true... > Pumping a liquid with high heat capacity to it steepens the gradient where you need it. Where you need it is at the surface of the CPU package. Both solutions provide adequate heat capacities at that location, that's why they fundamentally work. One uses heat pipes and fins directly above with fans/air carrying the heat away, the other moves the heat, and does the same elsewhere. > Cooling the liquid on the other hand can happen over a much larger surface area with shallower gradients and thus lower heat flux. Note that while the heat pipes in air coolers do use convection they do so passively, liquid cooling solutions are active. This is a basic explanation of how water cooling works, it doesn't really add any specific insight into the problem scope.

deleted 7y ago
[deleted]
the8472 7y ago
You updated your post since I have made my comment. I have no issues with the new version.
- Someone1234 7y ago
  I did tone down the language immediately after posting it. But you also altered yours after posting it (the third paragraph was a later addition).