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Well, the Lakefield design is fully 3D, and Intel has not announced any chiplet based designs, so either they made it all up, or they're convinced they can make
by ATsch 7y ago
Well, the Lakefield design is fully 3D, and Intel has not announced any chiplet based designs, so either they made it all up, or they're convinced they can make it work in the next few years.
- Veedrac 7y agoLakefield is a 1+4 core part, it's tiny and won't need chiplets. Chiplets are necessary only once you get to core counts that won't fit on a single square of silicon. Intel have announced co-EMIB, which seems to be their solution to 2D integration of 3D-stacked parts. https://fuse.wikichip.org/news/2503/intel-introduces-co-emib-to-stitch-multiple-3d-die-stacks-together-adds-omni-directional-interconnects/ https://fuse.wikichip.org/news/2503/intel-introduces-co-emib...