This step is inevitable in my opinion. This is especially true for mixed signal (that is some digital and some analog components) systems. It's early fore-bear

This step is inevitable in my opinion. This is especially true for mixed signal (that is some digital and some analog components) systems. It's early fore-bearer (multi-chip modules or MCM) was instrumental in IBM getting its later mainframes to hit the density and thermal constraints. Like the authors, when I saw AMD's chiplet pictures for the Zen2 chips I felt that we would see this expanded. Intel has also done some interesting optical chip to chip interconnects that would facilitate assembling these newer multichip modules into chassis that route signals to and from the outside world. The next (and perhaps last) element to fall into place is a way to efficiently cool these systems. One of the problems that large data centers face is not that they want "smaller" boxes but that they need to pull enough heat out of a rack of servers in order for them to reliably function.