3 ms·
What if we utilized the 3rd dimension just a wild idea. Also designed chips as long rectangular, more surface area.
by techsin101 7y ago
What if we utilized the 3rd dimension just a wild idea. Also designed chips as long rectangular, more surface area.
- lorenzq 7y agoHeat dissipation is the killer
- hevi_jos 7y agoIt is used. 3d stacking is called. Most memory devices, like pendrives use that.
- gameswithgo 7y agowe have been in various ways for a long time. as you stack higher and higher it gets harder to get the heat out, and its already really tough to get the heat out. Like intel's fastest gaming processor, the 9900k, the major difference is better heat dissipation material between the die and heat spreader. laptops and phones are mostly all thermally limited die shrinks help with this, but only if you don't increase performance as you do it.