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Can you do something like this for semiconductor devices? Although I assume destructive EEPROM erase in software combined with some explosives is an easier solu
by segfaultbuserr 7y ago
Can you do something like this for semiconductor devices? Although I assume destructive EEPROM erase in software combined with some explosives is an easier solution...
- dredmorbius 7y agoThermal or chemical dissolution might be easier. Fabrication with preinstalled thermite charges would generally suffice. You'd know there had been a device there, but it would be difficult to reverse-engineer. It beats beating on stuff with axes: https://www.globalsecurity.org/org/news/2001/010406-aries1.htm https://www.globalsecurity.org/org/news/2001/010406-aries1.h...
- segfaultbuserr 7y agoInteresting to see the military still didn't have a mature solution of secure physical destruction for things other than crypto keys.
- dredmorbius 7y agoHammers and axes tend not to go off unintentionally in confined spaces and/or at altitude.
- wahern 7y agoYeah, but we're talking about the military, where bullets, bombs, and missiles are stuffed in every conceivable crevice of your person and vehicle. Carrying around violently explosive material is what they do.
- dredmorbius 7y agoBullets, bombs, and missiles are produced in quantity with a long safety-assurance development and learning cycle. Mistakes are known to have happened. Sensitive electronics are small-batch (if not one-off) deployments. Mixing volatiles and circuits with confinement and altitude tends to put a lot of risk adjacent to extremely low tolerances for out-of-range behaviours. At the very least, that's an argument for using a Standard Thermite Pack separately packaged (and possibly with separated incredients and factors) which could be applied as needed, when needed. Or some equivalent mechanism.